PlasmaProTM System133 - 300mm Plasma Etch & Deposition Tool (R&D)

PlasmPro System133
PlasmaPro System133 R&D tool

Research & Development tool for up to 300mm wafers

The PlasmaPro System133 process tool offers 300 mm large batch etch and deposition capability, with flexible configurations allowing ICP, RIE, PECVD and ICP-CVD (HD-PECVD) processes on a wide range of materials and device applications.

 

 

 

 

  • Images 
  • Process Techniques 
  • Key Features 
  • Processes 
  • Support 
 
 Plasmalab System133 PECVD open - Click for larger image  Plasmalab System133 PECVD open detail - Click for larger image  Plasmalab System133 ICP open - Click for larger image  Plasmalab System133 ICP open detail - Click for larger image

    PlasmaPro System133 Process Techniques

    We work closely with our customers to develop new and customised processes according to their application needs; please contact us for details.

    Product Features

    • 300 mm single wafer capability Industry-leading batch wafer processing of:
      20 x 2" , 8 x 3" , 4 x 4"
    • Options of single wafer/batch or cassette loading via the load-locked wafer entry: the PlasmaPro System133 can be integrated into a cluster system with central robotic wafer handler and full cassette-to-cassette wafer handling for production processes
    • Substrate temperature control is provided by a range of electrodes, with a temperature range of -150 °C to +700 °C
    • Endpoint detection by laser interferometry and/or optical emission spectroscopy can be fitted to the PlasmaPro System133 to enhance etch control
    • Options of a 4-, 8- or 12-line gas pod provide flexibility in processes and process gases, and may be remotely sited in the service area, away from the main process tool

    Processes 

    Contact us for details in our process performance datasheets on 300mm and large-batch applications, for example:

    • HBLEDs: industry-leading batch production performance for: GaN, AlGaN and related materials; sapphire and SiC substrate etch
    • 300 mm SiO2, SiNx deposition
    • Diamond-like carbon (DLC) deposition and etch
     - A Global Reach

    Oxford Instruments is committed to supporting our customers’ success. We recognise that this requires world class products complemented by world class support. Our global service force is backed by regional offices, offering rapid support wherever you are in the world.

     Service Centres*

      Parts Centres

    Europe & Middle East

    Montevrain, France
    Wiesbaden, Germany
    Haifa, Israel
    St Petersburg, Russia
    Moscow, Russia
    Bristol, UK

    USA

    Arizona, USA
    Texas, USA
    San Francisco, CA, USA
    Concord, MA, USA

    Asia

    Beijing, China
    Guangzhou, China
    Shanghai, China
    Hong Kong
    New Delhi, India
    Mumbai, India
    Calcutta, India
    Bangalore, India
    Tokyo, Japan
    Kyungki-do, Korea
    Penang, Malaysia
    Singapore
    Taiwan County, Taiwan

    Asia

    Shanghai, China
    Taiwan County, Taiwan

    EMEA

    Bristol, UK

    USA

    Concord, MA, USA

    *Includes agents with OIPT trained engineers

    For information on our Flexible Support Agreements please visit our Support pages

    Contact Us

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