PlasmaProTM System100 - Production System

PlasmaPro System100 Production tool

The PlasmaPro System100 tool has up to 200mm single wafer production capability, offering excellent uniformity and high throughput on a range of applications.

Key Features:

8" wafer handling, also allowing small batch (6 x 2") pre- and pilot production capability
Single wafer loading via the load-locked wafer entry.
Substrate temperature control is provided by a range of electrodes, with a temperature range of -150 °C to +700 °C
Endpoint detection by laser interferometry and/or optical emission spectroscopy can be fitted to the PlasmaPro System100 to enhance etch control
Options of a 6- or 12-line gas pod provides flexibility in processes and process gases, and may be remotely sited in the service area, away from the main process tool

Images
Process Control
Process Techniques
Wafer Handling
Support

Plasamalab System100Pro - Click for larger image

Plasmalab System100Pro - Click for larger image

PlasmaPro System100 Process Control

Large wafer area and batch process end-pointing by optical emission spectrometry (OES) :
OES detects changes in etch by-products or depletion of reactive gas species
Predictive chamber cleaning end-pointing
Integrated with the PC2000TM process tool software
Laser end-point detection (LEPD) also available for blanket etching or where mask patterns allow, or for deposition monitoring

PlasmaPro System100 Process Techniques

Reactive Ion Etch (RIE)
Inductively Coupled Plasma Etch (ICP)
Plasma Enhanced Chemical Vapour Deposition (PECVD)
Inductively Coupled Plasma Chemical Vapour Deposition (ICP CVD)

We work closely with our customers to develop new and customised processes according to their application needs; please contact us for details.

Wafer Handling

Up to 200mm single wafer processing

Multi-wafer batch processing for 50 mm (2”) to 100 mm (4”), including cassette loading of batch carrier plates

Cassette-to-cassette handling with full wafer tracking and individual wafer process control where required

Hexagonal or square robotic handlers, with MESC compatibility allowing further addition of third-party modules

E-chuck and/or mechanical clamping options, with He wafer backside cooling

Wide temperature range substrate electrodes: -150°C to 400°C or 700°C

- A Global Reach

Oxford Instruments is committed to supporting our customers’ success. We recognise that this requires world class products complemented by world class support. Our global service force is backed by regional offices, offering rapid support wherever you are in the world.

Service Centres*

Parts Centres

Europe & Middle East

Montevrain, France
Wiesbaden, Germany
Haifa, Israel
St Petersburg, Russia
Moscow, Russia
Bristol, UK

USA

Arizona, USA
Texas, USA
San Francisco, CA, USA
Concord, MA, USA

Asia

Beijing, China
Guangzhou, China
Shanghai, China
Hong Kong
New Delhi, India
Mumbai, India
Calcutta, India
Bangalore, India
Tokyo, Japan
Kyungki-do, Korea
Penang, Malaysia
Singapore
Taiwan County, Taiwan

Asia

Shanghai, China
Taiwan County, Taiwan

EMEA

Bristol, UK

USA

Concord, MA, USA

*Includes agents with OIPT trained engineers

For information on our Flexible Support Agreements please visit our Support pages

Please click here if you would like additional information or assistance