HVPE from Oxford Instruments
TDI, a wholly owned subsidiary of Oxford Instruments, is a world leader in the development of Hydride Vapour Phase Epitaxy (HVPE) processes and techniques for the production of novel compound semiconductors such as GaN, AlN, AlGaN, InN, InGaN.
Using TDI HVPE technology, Oxford Instruments can produce templates for applications such as:
- High Brightness Light Emitting Diodes (HBLEDs)
- Laser Diodes
- High Electron Mobility Transistors (HEMT)
Processing capabilities offered through TDI laboratories include:
- Custom design Epitaxy
- Many templates supplied from stock
- Low to medium volume templates on 2”, 3” & 4” wafers as standard
- Research and development programmes & contracts undertaken for specific client requirements
- Low dislocation density
- Wide range of layer thickness up to 150 µm
- Cost effective templates for device manufacturing
- P and N type doped materials are available
- Processing capabilities offered through TDI laboratories
The TDI compound semiconductor templates product range includes:
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Gallium Nitride Wafers |
Gallium Nitride on Sapphire templates
GaN template may be used as a substrate for III-V nitride epitaxial growth by MBE, MOCVD and CVD.
The following GaN epi on Sapphire are available:
- Undoped GaN
- n-GaN, Si-doped
- p-GaN, Mg-doped
- i-GaN, high resistivity, Zn-compensated
- a-plane GaN on r-plane Sapphire
Applications:
- Ideal substrates for GaN homoepitaxial growth and device manufacturing.
- Excellent material for production, product development and fundamental research
- New type of substrate for GaN-based Blue/Green/White/UV LEDs.
- Substrates for III-V nitride epitaxial growth by MBE, MOCVD and CVD.
- Thick GaN is enabling new applications like High Brightness LEDs manufactured with Laser Lift Off
Gallium Nitride template on SiC
Applications
- GaN Epitaxial Wafers may be used as substrates for III-V nitride epitaxial growth by MBE, MOCVD and CVD.
- No buffer layer is required.
- GaN Epitaxial Wafers are the ideal substrates for GaN homoepitaxial growth and device manufacturing.
Technology
- Gallium Nitride Epitaxial Wafer (template) consists of a thin undoped GaN epitaxial layer grown by Hydride Vapour Phase Epitaxy (HVPE) directly on (0001) Si face on-axis 6H-SiC or 4H-SiC substrate.
Additional information
- GaN layers and SiC substrates are electrically conducting. Silicon carbide ensures excellent heat removal from nitride device structure, which is important for high-power devices. GaN/SiC wafers may be cleaved providing mirror-like facets for nitride laser diodes.
- GaN layers could be grown on SiC substrates supplied by customers.
Aluminum Nitride Layers for III-V Nitride Epitaxy and High Frequency Applications
Two types of templates are available:
- Standard grade, usable area >90%
- Research grade, usable area >80%
Research grade templates are supplied at reduced price subject of availability.
User benefits to use AlN templates
- Start growth on native AlN surface
- Simplify nucleation process (no buffer layer is needed)
- Reduce defect density in device structure
- Improve device parameters
- Increase epi productivity on existing growth equipment
- Reduce epi cost via throughput and yield increase
- Reduce maintenance cost
- Avoid possible patent contest issues related to buffer layer
Thick crack free AlN on SiC template
Applications: semi-insulating substrate for:
- Power AlGaN/GaN-based High Electron Mobility Transistors ( HEMT)
- Power blue and UV LEDs, and Laser Diodes
Properties:
- High electrical resistivity and thermal conductivity
- Close lattice and thermal match with GaN and AlGaN layers
- Low defect density in device structures
- Thickness of AlN is sufficient to provide reliable insulation and low current leakage
- Fraction of price of semi-insulating SiC
- Positively tested at customers enabling dramatic cost reduction of final HEMT devices
Aluminum Gallium Nitride on Sapphire template
Two types of templates are available:
- Standard grade, usable area >90%
- Research grade, usable area >80%
Research grade templates are supplied at reduced price subject of availability.
User benefits to use AlGaN templates
- Start growth on native AlGaN surface
- Simplify nucleation process (no buffer layer is needed)
- Reduce defect density in device structure
- Improve device parameters
- Increase epi productivity on existing growth equipment
- Reduce epi cost via throughput and yield increase
- Reduce maintenance cost
- Avoid possible patent contest issues related to buffer layer
Indium Nitride Epitaxial Materials
TDI offers the availability of pilot samples of InN epitaxy. InN materials consist of InN epitaxial layer deposited on GaN/sapphire template.
Indium Nitride Layers for Sensors and High Frequency Applications
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Schematic cross section of InN/GaN/Sapphire sample |
InN Wafer |
TDI offers the availability of pilot samples of InN epitaxy. InN materials consist of InN epitaxial layer deposited on GaN/sapphire template.
We would be happy to satisfy your needs in InN and appreciate your feedback on desirable material parameters.
Material Parameters:
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Typical thickness of InN, microns |
0.1-0.5 |
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Initial Substrate |
C-plane sapphire |
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Diameter, inch |
2 |
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Surface of InN |
As grown |
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Electrical conductivity of InN |
n-type |
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Concentration Nd-Na, cm-3 |
> 5E18 |
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Typical electron mobility, cm2/V sec |
10-120 |
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FWHM of x-ray RC omega-scan (00.2), arcsec |
< 900 |
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Optical band gap*, eV |
~1.8 |
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n-GaN layer thickness, microns |
> 3 |
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*Estimated based on CL and transmission reflection measurements |
InxGa1-xN Template Substrates Typical parameters of InxGa1-xN layers
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InN Content (x) |
0.05-0.2 |
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FWHM of ω scan X-ray (00.2) rocking curve,arc sec |
< 900 |
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Thickness, Microns |
0.02-0.5 |
- Fabrication method: Hydride Vapour Phase Epitaxy (HVPE)
- For GaN on sapphire template parameters download our datasheet
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X-Ray diffraction spectrum measured for InGaN layer grown on GaN/Sapphire |
ω-scan rocking curve measured for InGaN layer grown on GaN/Sapphire |
InGaN Wafer |