Compound Semiconductor Templates - TDI

LED
HVPE from Oxford Instruments

TDI, a wholly owned subsidiary of Oxford Instruments, is a world leader in the development of Hydride Vapour Phase Epitaxy (HVPE) processes and techniques for the production of novel compound semiconductors such as GaN, AlN, AlGaN, InN, InGaN.

Using TDI HVPE technology, Oxford Instruments can produce templates  for applications such as:

  • High Brightness Light Emitting Diodes (HBLEDs)
  • Laser Diodes
  • High Electron Mobility Transistors (HEMT)

 

Processing capabilities offered through TDI laboratories include:

  • Custom design Epitaxy
  • Many templates supplied from stock
  • Low to medium volume templates on 2”, 3” & 4” wafers as standard
  • Research and development programmes & contracts undertaken for specific client requirements
  • Low dislocation density
  • Wide range of layer thickness up to 150 µm
  • Cost effective templates for device manufacturing
  • P and N type doped materials are available
  • Processing capabilities offered through TDI laboratories

 

The TDI compound semiconductor templates product range includes:

  • GaN  
  • AlN 
  • AlGaN 
  • InN 
  • InGaN 

 Wafers

Gallium Nitride Wafers

Gallium Nitride on Sapphire templates

GaN template may be used as a substrate for III-V nitride epitaxial growth by MBE, MOCVD and CVD.

The following GaN epi on Sapphire are available:

  • Undoped GaN
  • n-GaN, Si-doped
  • p-GaN, Mg-doped
  • i-GaN, high resistivity, Zn-compensated
  • a-plane GaN on r-plane Sapphire

 Applications:

  • Ideal substrates for GaN homoepitaxial growth and device manufacturing.
  • Excellent material for production, product development and fundamental research
  • New type of substrate for GaN-based  Blue/Green/White/UV LEDs.
  • Substrates for III-V nitride epitaxial growth by MBE, MOCVD and CVD.
  • Thick GaN is enabling new applications like High Brightness LEDs manufactured with Laser Lift Off

 

Gallium Nitride template on SiC

Applications

  • GaN Epitaxial Wafers may be used as substrates for III-V nitride epitaxial growth by MBE, MOCVD and CVD.
  • No buffer layer is required. 
  • GaN Epitaxial Wafers are the ideal substrates for GaN homoepitaxial growth and device manufacturing.
     

Technology

  • Gallium Nitride Epitaxial Wafer (template) consists of a thin undoped GaN epitaxial layer grown by Hydride Vapour Phase Epitaxy (HVPE) directly on (0001) Si face on-axis 6H-SiC or 4H-SiC substrate.

Additional information

  • GaN layers and SiC substrates are electrically conducting.  Silicon carbide ensures excellent heat removal from nitride device structure, which is important for high-power devices. GaN/SiC wafers may be cleaved providing mirror-like facets for nitride laser diodes. 
  • GaN layers could be grown on SiC substrates supplied by customers.

Aluminum Nitride Layers for III-V Nitride Epitaxy  and  High Frequency Applications

Two types of templates are available: 

  • Standard grade, usable area >90%
  • Research grade, usable area >80%

Research grade templates are supplied at reduced price subject of availability.

User benefits to use AlN templates

  • Start growth on native AlN surface
  • Simplify nucleation process (no buffer layer is needed)
  • Reduce defect density in device structure
  • Improve device parameters
  • Increase epi productivity on existing growth equipment
  • Reduce epi cost via throughput and yield increase
  • Reduce maintenance cost
  • Avoid possible patent contest issues related to buffer layer

 

Thick crack free AlN on SiC template

Applications: semi-insulating substrate for:

  • Power AlGaN/GaN-based High Electron Mobility Transistors ( HEMT)
  • Power blue and UV LEDs, and Laser Diodes

Properties:

  • High electrical resistivity and thermal conductivity
  • Close lattice and thermal match with GaN and AlGaN layers
  • Low defect density in device structures
  • Thickness of AlN is sufficient to provide reliable insulation and low current leakage
  • Fraction of price of semi-insulating SiC
  • Positively tested at customers enabling dramatic cost reduction of final HEMT devices

Aluminum Gallium Nitride on Sapphire template

Two types of templates are available:

  • Standard grade, usable area >90%
  • Research grade, usable area >80%

Research grade templates are supplied at reduced price subject of availability.

User benefits to use AlGaN templates

  • Start growth on native AlGaN surface
  • Simplify nucleation process (no buffer layer is needed)
  • Reduce defect density in device structure
  • Improve device parameters
  • Increase epi productivity on existing growth equipment
  • Reduce epi cost via throughput and yield increase
  • Reduce maintenance cost
  • Avoid possible patent contest issues related to buffer layer

Indium Nitride Epitaxial Materials

TDI offers the availability of pilot samples of InN epitaxy.  InN materials consist of InN epitaxial layer deposited on GaN/sapphire template. 

Indium Nitride Layers for Sensors and  High Frequency Applications

 

Indium Nitride on Sapphire

 

Indium Nitride Wafer

Schematic cross section of InN/GaN/Sapphire sample

InN Wafer

 

 

 

 

 

 

 

 

TDI offers the availability of pilot samples of InN epitaxy.  InN materials consist of InN epitaxial layer deposited on GaN/sapphire template.

We would be happy to satisfy your needs in InN and appreciate your feedback on desirable material parameters.

Material Parameters:

Parameter

Value

Typical thickness of InN, microns

0.1-0.5

Initial Substrate

C-plane sapphire

Diameter, inch

2

Surface of InN

As grown

Electrical conductivity of InN

n-type 

Concentration Nd-Na, cm-3

> 5E18

Typical electron mobility, cm2/V sec

10-120

FWHM of x-ray RC omega-scan (00.2), arcsec

< 900

Optical band gap*, eV

~1.8

n-GaN layer thickness, microns

> 3

*Estimated based on CL and transmission reflection measurements

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Ω 20 scan - Click for larger image X-Ray diffraction map - Click for larger image

XRD spectrum of InN/GaN on sapphire wafer, Ω 20 scan

2-inch InN-epi X-ray diffraction map (FWHM of omega-scan (00.2) rocking curve)
XRD omega-scan rocking curves (00.2) - Click for larger image (a) omega-scan rocking curves (10.2) - Click for larger image(b)    
XRD omega-scan rocking curves for InN (00.2) and (10.2) reflections (a) and (b), respectively.

InxGa1-xN Template Substrates Typical parameters of InxGa1-xN layers

InN Content (x)

0.05-0.2

FWHM of ω scan X-ray (00.2) rocking curve,arc sec

< 900

Thickness, Microns

0.02-0.5

  • Fabrication method: Hydride Vapour Phase Epitaxy (HVPE)
  • For GaN on sapphire template parameters download our datasheet 

 

X-Ray Diffraction Spectrum - Click for larger image

 

ω-scan rocking curve - Click for larger image

InGaN Wafer

X-Ray diffraction spectrum measured for InGaN layer grown on GaN/Sapphire

ω-scan rocking curve measured for InGaN layer grown on GaN/Sapphire

InGaN Wafer

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