CMI760E and CMI760EN
CMI760E and CMI760EN for Cu thickness measurements. The CMI760E and CMI760EN packages measures surface Cu thickness and plated through hole (PTH) Cu thickness applications to serve the quality control needs of the Printed Circuit Board (PCB) industry.
The CMI 760E and CMI760EN packages measures surface Cu thickness and plated through hole (PTH) Cu thickness applications to serve the quality control needs of the Printed Circuit Board (PCB) industry. The package consists of a CPU unit, two distinctly different probes and NIST traceable calibration standards.
The surface Cu probe utilizes Oxford Instruments proprietary SRP-4 microresistance technology featuring user-replaceable measurement tips for the standard (CMI760, SRP-4) and narrow (CMI760N, SRP-4N) varieties.
The PTH Cu thickness probe, the ETP, utilizes eddy-current technology to measure Cu thickness on the walls of plated vias or plated through holes on PCBs. Additionally the TRP Measurement Module with fixed XY stage can be added for microresistance measurements of Cu thickness and quality in plated through holes.
- Measure copper thickness on PCBs
- Measure foil or laminated copper thickness in mils, µm or copper weight (oz)
- Determine electroless or electroplated Cu thickness on PCBs
- Accurately quantify copper thickness after etching or planarizing
- Verify copper plating thickness on PCB surface and in Plated Through Holes
- CPU unit features a high contrast color LCD display
- Memory to store up to 5000 measurements, parameters and calibrations
- RS232 PC connectivity
- Parallel printer port
- Multi-level user password security system
- Statistical data analysis with histogram, X-bar, R-chart, trend charts which can be viewed on the display or printed direct from the instrument